Sensor Systems Simulations (eBook)

From Concept to Solution
Artikelnummer: 978-3-030-16577-2
Einband: PDF
Verfügbarkeit: Download, sofort verfügbar (Link per E-Mail)
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This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems.  Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT-enabling systems, and IoT sensor system reliability.

  • Describes from component to system level simulation, how to use the available simulation techniques for reaching a proper design with good performance;
  • Explains how to use simulation techniques such as Finite Elements, Multi-body, Dynamic, stochastics and many more in the virtual design of sensor systems;
  • Demonstrates the integration of several sensor solutions (thermal, dust, occupancy, distance, awareness and more) into large-scale system solutions in several industrial domains (Lighting, automotive, transport and more);
  • Includes state-of-the-art simulation techniques, both multi-scale and multi-physics, for use in the electronic industry.


This book describes for readers various technical outcomes from the EU-project IoSense. The authors discuss sensor integration, including LEDs, dust sensors, LIDAR for automotive driving and 8 more, demonstrating their use in simulations for the design and fabrication of sensor systems.  Readers will benefit from the coverage of topics such as sensor technologies for both discrete and integrated innovative sensor devices, suitable for high volume production, electrical, mechanical, security and software resources for integration of sensor system components into IoT systems and IoT-enabling systems, and IoT sensor system reliability.

  • Describes from component to system level simulation, how to use the available simulation techniques for reaching a proper design with good performance;
  • Explains how to use simulation techniques such as Finite Elements, Multi-body, Dynamic, stochastics and many more in the virtual design of sensor systems;
  • Demonstrates the integration of several sensor solutions (thermal, dust, occupancy, distance, awareness and more) into large-scale system solutions in several industrial domains (Lighting, automotive, transport and more);
  • Includes state-of-the-art simulation techniques, both multi-scale and multi-physics, for use in the electronic industry.


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VerlagSpringer International Publishing
EinbandPDF
Erscheinungsjahr2019
Seitenangabe456 S.
AusgabekennzeichenEnglisch
AbbildungenXII, 456 p. 274 illus., 222 illus. in color.
Masse16'397 KB
PlattformPDF
AutorDriel, Willem Dirk van (Hrsg.) / Pyper, Oliver (Hrsg.) / Schumann, Cornelia (Hrsg.)

Über den Autor Willem Dirk van (Hrsg.) Driel

Willem Dirk van Driel has a >30-year track record in the reliability domain. Application areas range from healthcare, gas and oil explorations, semiconductors and my current position in Philips Lighting where he is responsible for Solid State Lighting reliability. Besides that, he holds a professor position at the University of Delft, The Netherlands. His scientific interests are solid state lighting, microelectronics and microsystems technologies, virtual prototyping, virtual reliability qualification and designing for reliability of microelectronics and microsystems. He acts as the chair for the organizing committee of the IEEE conference EuroSimE and has authored and co-authored more than 350 scientific publications, including journal and conference papers, book or book chapters and invited keynote lectures. He holds 20 patents. He is a certified DFSS Black Belt. Klaus Pressel received his PhD in Physics from the University of Stuttgart on research of point defects in III/V semiconductors. He then changed to IHP Frankfurt (Oder), where he focused on Si and SiGe design and technology. In 2001 Klaus joined Infineon Technologies at Regensburg, where he focuses now on innovations in assembly and packaging technology. His special interests are system integration, high frequency applications, and chip-package-board/system co-design. Throughout his carrier reliability of semiconductor devices played a major role. Klaus has been project leader of various European ECSEL JU and EUREKA projects. His ECSEL JU project ESiP, where reliability of SiP was a core topic, received the ECSEL JU innovation award in 2013. Klaus is representing Infineon in various international technical committees, e.g. SEMI Advanced Packaging Conference, IEEE ESTC conference, the Eureka XECS program, and supports the European ECS-SRIA as well as the IEEE Heterogenous Integration Roadmap. Klaus is author/co-author of more than 200 publications in semiconductor physics and technology, circuit design, assembly and interconnect technology and owns/co-owns more than 20 patents. Mujdat Soyturk, Associated Professor at Marmara University, received his Ph.D. and M.Sc. degrees in Computer Engineering from Istanbul Technical University in 2007 and 2002, respectively. His expertise and research interests include V2X Communications/Connected Cars, Wireless Networks, IoT, and Cyber-Physical Systems. Communication reliability, service availability and data analytics are among research topics he contributes. He is directing the VeNIT Research Laboratory (www.venit.org), which he founded in 2013 for studies in the field of ITS and V2X Communications. He carried out many R&D projects financed by the European Union and nationally. He served as a member of the Editorial Board, TPC, and as a reviewer for many high-ranked journals and conferences  (>100 SCI/SCIE journals, > 1000 conferences).  

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